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Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
·* Impedance control
·* Solder-ability detection
* Digital metallograghic microscope
·*AOI (Automated Optical Inspection)
Detailed Terms for PCB Manufacturing
---Technical requirement for pcb assembly:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206,0805,0603 components SMT technology
* ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
* PCB Assembly With UL,CE,FCC,Rohs Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.
Surface Treatment
Lead-free HAL
Gold Plating (1-30 micro inch)
OSP
Silver Plating
Pure Tin Plating
Immersion Tin
Immersion Gold
Gold Finger
Other Service:
A) We have many special material as rogers, teflon, taconic, Fr-4 high tg, Ceramic in stock. Welcome to send us your inquiry.
B) We also provide sourcing components , PCB design , PCB copy , PCB drawing , PCB assembly and so on .
Product Details:
Payment & Shipping Terms:
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| High Light: | led light assembly,led lamp assembly |
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High quality Led pcb assembly, led pcba with led lights (Aluminum-based & FR4 material
Specifications
led pcb assembly
1. PCB layout and fabrication
2. Components procurement
3. PCB Assembly of SMT and DIP
4. IC pre-program / burning on line
5. High-precision E-Testing include: AOI, ICT, functional test,
6. Aging test for all LED PCBA
We can ensure the best price, good quality, fast delivery and best after-sales service!
Welcome to Huaswin!
Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.
We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP
assembly ,IC pre-programming / burning on-line, testing, anti-static packing.
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
Detailed Specification of PCB Manufacturing
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1 |
layer |
1-30 layer |
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2 |
Material |
CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
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3 |
Board thickness |
0.2mm-6mm |
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4 |
Max.finished board size |
800*508mm |
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5 |
Min.drilled hole size |
0.25mm |
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6 |
min.line width |
0.075mm(3mil) |
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7 |
min.line spacing |
0.075mm(3mil) |
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8 |
Surface finish |
HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
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9 |
Copper thickness |
0.5-4.0oz |
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10 |
Solder mask color |
green/black/white/red/blue/yellow |
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11 |
Inner packing |
Vacuum packing,Plastic bag |
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12 |
Outer packing |
standard carton packing |
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13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
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14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
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15 |
Profiling punching |
Routing,V-CUT,Beveling |
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing
Detailed Specification of Pcb Assembly
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1 |
Type of Assembly |
SMT and Thru-hole |
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2 |
Solder Type |
Water Soluble Solder Paste,Leaded and Lead-Free |
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3 |
Components |
Passives Down to 0201 Size |
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BGA and VFBGA |
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Leadless Chip Carries/CSP |
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Double-Sided SMT Assembly |
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Fine Pitch to 08 Mils |
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BGA Repair and Reball |
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Part Removal and Replacement-Same Day Service |
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3 |
Bare Board Size |
Smallest:0.25x0.25 Inches |
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Largest:20x20 Inches |
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4 |
File Formats |
Bill of Materials |
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Gerber Files |
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Pick-N-Place File(XYRS) |
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5 |
Type of Service |
Turn-Key,Partial Turn-Key or Consignment |
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6 |
Component Packaging |
Cut Tape |
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Tube |
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Reels |
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Loose Parts |
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7 |
Turn Time |
15 to 20 days |
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8 |
Testing |
AOI inspection |
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X-Ray inspection |
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In-Circuit testing |
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Functional test |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
